Key figures of the SSCL China Expo 2025. [Photo/WeChat ID: SZW-SSCL2022]
The eighth Smart Supply Chain and Logistics Innovation Expo & 16th Shanghai International Logistics Festival, known as the SSCL China Expo 2025, has begun at the Hongqiao Import Commodity Exhibition and Trade Center in Shanghai.
This year's expo, an influential event for supply chain and logistics innovation in the Asia-Pacific region, will run from May 15-16 and is expected to draw more than 150 exhibitors, 300 speakers, 100 industry media representatives, and over 8,000 professional visitors.
The expo's main forum is set to tackle crucial topics in supply chain management, including resilient supply chain transformation, AI-driven logistics, and sustainable development. With 11 sub-forums, the event covers a wide range of hot topics, aiming to address current challenges and uncover new opportunities.
Renowned for setting trends in the supply chain and logistics sector, the SSCL China Expo integrates four key elements: a 6,000-participant summit, an ecological innovation exhibition, the prestigious Golden Chain Awards, and a national supply chain management innovation challenge.
At the summit, over 300 experts will engage in discussions on logistics and supply chain strategies. Meanwhile, the SSCL Ecological Innovation Exhibition will highlight cutting-edge products, technologies, and services across more than 6,000 square meters, offering exhibitors a chance to showcase their innovations.
The Golden Chain Awards, supported by international bodies CSCMP and TAPA APAC, recognize companies that demonstrate outstanding technological and business innovation. This year, over 200 case studies are competing for these coveted awards.
Additionally, the SSCL National Supply Chain Management Innovation Elite Challenge, organized in collaboration with the Shanghai Management Science Society, includes competitions for enterprises, universities, and vocational institutions. It aims to promote innovation and excellence in supply chain management practices.
